U.S. Announces Samsung Electronics Incentives for Semiconductor Production
Supply Chain Matters
APRIL 16, 2024
Further being planned is a chip-packaging facility that can support 3 -D packaging for high bandwidth memory (HBM) production needs. based production investments is the ability to streamline both cutting-edge advanced processor chips along with the packaging of HBM based memory needs. Under the provisions of the U.S.
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